Media
HKU and Tohoku University sign Agreement on
Collaborations in Transformative AI and Robotics Technologies
13 Mar 2019
The application of robots to our daily lives is becoming more extensive, such as in medical applications where they can be used for the development of sophisticated surgical instruments, or in home applications such as taking care of elderly people or in rehabilitation equipment, as well as other social, industrial and commercial uses.
The University of Hong Kong (HKU) will sign an agreement with Tohoku University, Japan (Tohokudai) to collaborate on the research of transformative AI and robotics technologies.
While HKU has a strong platform technology in the areas of Computer Vision, Sensing, Control, Motion and Planning, Systems Integration and Modeling and Simulation, Tohokudai is recognised internationally for its cutting-edge applications of robot technology such as creating human-friendly robots which enable intelligent exchanges with humans for society and industry use.
HKU and Tohokudai’s strategic collaboration will bring together top researchers from both universities to focus on cutting-edge research and application development in the fields of transformative artificial intelligence and robotics, including establishing a Centre for Transformative AI and Robitics Technologies (TransART), to spearhead projects around transforming manufacturing industries and megacities with the application of AI and Robotics. The team will apply for the next round of the HKSAR government's major initiative, AIR@InnoHK under the Innovation & Technology Commission.
We cordially invite you to join us at the media briefing, where the facilitators of the project will further elaborate on the development trend of robotic technology application, and the research plans for humanoid robots. Details are as follows:
Media Briefing
Date: 14 March 2019 (Thursday)
Time: 11:30am
Venue: HW501, 5/F Haking Wong Building, The University of Hong Kong (MTR HKU Exit A2)
Speakers:
Professor Norman C.Tien, Taikoo Professor of Engineering, Chair Professor of Microsystems Technology, Department of Electrical and Electronic Engineering, The University of Hong Kong ;
Professor Kazuhiro Kosuge, Distinguished Professor, Graduate School of Engineering of Tohoku University Japan;
Dr. K. W. Kwok, Assistant Professor, Department of Mechanical Engineering, The University of Hong Kong;
Language: English (Supplemented with Cantonese)
Please also find below the details of the agreement signing ceremony (open to media):
Signing Ceremony of Agreement between HKU and Tohokudai
Date: 16 March 2019 (Saturday)
Time: 3:00pm (Media registration at 2:30pm)
Venue: Convocation Room, Main Building, The University of Hong Kong (MB218, 2/F, Main Building, The University of Hong Kong MTR HKU Exit A1)
Officiating guests of the ceremony:
Mr. Nicholas W Yang, GBS, JP, Secretary for Innovation and Technology , HKSAR Government
Professor Xiang Zhang, President and Vice-Chancellor, The University of Hong Kong
Professor Ian Holliday, Vice-President and Pro-Vice-Chancellor (Teaching & Learning), The University of Hong Kong
Professor Christopher Y.H. Chao, Dean of Engineering, The University of Hong Kong
Professor Norman C.Tien, Taikoo Professor of Engineering, Chair Professor of Microsystems Technology, Department of Electrical and Electronic Engineering, The University of Hong Kong ; and his delegation
Professor Hideo Ohno, President, Tohoku University, Japan
Professor Toshiya Ueki, Executive Vice President for General Affairs, Financial Affairs and International Relations, Tohoku University, Japan
Professor Masahiro Yamaguchi, Vice President for Education Reform and Global Engagement, Tohoku University, Japan
Professor Kazuhiro Kosuge, Distinguished Professor, Graduate School of Engineering of Tohoku University, Japan;
Language: English
Media enquiry:
Faculty of Engineering, HKU
Ms Celia Lee (Tel: 3917-8519 / Email: leecelia@hku.hk)
Communications and Public Affairs Office, HKU
Ms Rashida Suffiad (Tel: 2857 8555 / Email: rsuffiad@hku.hk)